Method of manufacturing low heat-resistant sensor
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United States of America Patent
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Aug 27, 2024
Grant Date -
Mar 28, 2024
app pub date -
Sep 28, 2020
filing date -
Oct 17, 2019
priority date (Note) -
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Abstract
To provide a method of manufacturing a low heat-resistant sensor that has high chemical resistance, excellent drip-proof properties, and excellent dust-proof properties. A method of manufacturing a low heat-resistant sensor includes a step of disposing a sensor unit in a recessed portion of a container composed of fluorine resin, inserting a cable into a through-hole in communication with the recessed portion, and electrically connecting the sensor unit that is disposed in the recessed portion and the cable to each other, a step of disposing a plate composed of fluorine resin such that the plate covers an opening of the recessed portion and capping the recessed portion, a step of covering the cable by using a tube composed of fluorine resin, a step of disposing a frame body composed of fluorine resin such that the frame body surrounds a perimeter of the plate, a step of thermally bonding the frame body, the container, and the plate to each other, and a step of thermally bonding the container and the tube to each other.
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