Conductive laminate and manufacturing method of conductive laminate
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United States of America Patent
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Aug 27, 2024
Grant Date -
Jul 13, 2023
app pub date -
Mar 8, 2023
filing date -
Sep 30, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.
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