Micro-acoustic wafer-level package and method of manufacture
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United States of America
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Aug 27, 2024
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app pub date -
Dec 13, 2019
filing date -
Dec 13, 2019
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Abstract
A wafer-level package for micro-acoustic devices and a method of manufacture is provided. The package comprises a base wafer with electric device structures. A frame structure is sitting on top of the base wafer enclosing particular device areas for the micro-acoustic devices. A cap wafer provided with a thin polymer coating is bonded to the frame structure to form a closed cavity over each device area and to enclose within the cavity the device structures arranged on the respective device area.
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