Bonding apparatus
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United States of America Patent
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Aug 20, 2024
Grant Date -
Aug 10, 2023
app pub date -
Jul 27, 2022
filing date -
Feb 10, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.
First Claim
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B25B:TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR,....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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