Arrangement of a power semiconductor module and a cooler

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United States of America Patent

PATENT NO 12068174
APP PUB NO 20220254653A1
SERIAL NO

17630080

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Abstract

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In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.

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Patent Owner(s)

Patent OwnerAddress
HITACHI ENERGY LTDBROWN-BOVERI-STRASSE 5 ZÜRICH 8050

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Agostini, Bruno Zurich, CH 53 323
Gradinger, Thomas Aarau Rohr, CH 34 199
Mohn, Fabian Ennetbaden, CH 22 58
Schuderer, Juergen Zurich, CH 13 29
Torresin, Daniele Baden, CH 33 47

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