Method for manufacturing semiconductor device and apparatus for manufacturing semiconductor device

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United States of America Patent

PATENT NO 12068165
APP PUB NO 20220293425A1
SERIAL NO

17677547

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Abstract

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There is provided a method for manufacturing a semiconductor device, including: attracting a semiconductor device wafer by a chuck mechanism and rotating the semiconductor device wafer horizontally; rotating a rotary blade horizontally by a vertical spindle to which ultrasonic waves are applied; trimming an outer peripheral end portion of the semiconductor device wafer that is horizontally rotating by the rotary blade that is horizontally rotating, to form a groove in the outer peripheral end portion; correcting a tip shape of the rotary blade that is horizontally rotating by a blade-forming grinding wheel during the trimming; and grinding one main surface of the semiconductor device wafer that is horizontally rotating by a cup grinding wheel that is horizontally rotating after the trimming.

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Patent Owner(s)

Patent OwnerAddress
OKAMOTO MACHINE TOOL WORKS LTDGUNMA GUNMA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bando, Tsubasa Gunma, JP 5 1
Mitsui, Takahiko Gunma, JP 31 90
Yamamoto, Eiichi Gunma, JP 25 162

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