Member for plasma processing device and plasma processing device provided with same
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United States of America Patent
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Aug 20, 2024
Grant Date -
Feb 10, 2022
app pub date -
Dec 2, 2019
filing date -
Dec 2, 2019
priority date (Note) -
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Abstract
Provided are a member for plasma processing device which has an excellent plasma resistance and improved adhesion strength of a film to a base material, and a plasma processing device provided with the same. A member for plasma processing device includes: a base material containing a first element which is a metal element or a metalloid element; a film containing a rare-earth element oxide, or a rare-earth element fluoride, or a rare-earth element oxyfluoride as a major constituent, the film being located on the base material; and an amorphous portion containing the first element, a rare earth element, and at least one of oxygen and fluorine, the amorphous portion being interposed between the base material and the film.
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