Systems and methods for additive manufacturing of wick structure for vapor chamber
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United States of America Patent
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Aug 20, 2024
Grant Date -
May 27, 2021
app pub date -
Feb 1, 2021
filing date -
Sep 8, 2017
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Abstract
A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure.
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