Surface-treated copper foil, copper-clad laminate and printed wiring board using the surface-treated copper foil
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United States of America Patent
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Aug 13, 2024
Grant Date -
Jun 27, 2024
app pub date -
Feb 1, 2022
filing date -
Apr 9, 2021
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Abstract
A surface-treated copper foil includes, on at least one surface of an untreated copper foil, a finely roughened layer formed of copper particles in which primary particles have a particle size of 10 nm to 110 nm or less, and a heat-resistant-treatment layer containing nickel and phosphorus, wherein a treated surface has a surface area ratio of 5.1 or more per 1 m2 of a two-dimensional area, the surface area ratio being calculated from a specific surface area measured by a krypton gas adsorption BET method, and a coating mass of the nickel is 2 mg or more per 1 m2 of a surface area.
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