Semiconductor module and method of manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12062883
APP PUB NO 20210057876A1
SERIAL NO

16965889

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Abstract

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A semiconductor module includes a sub-mount having a front surface, a back surface, side surfaces connecting the front surface and the back surface, a semiconductor element soldered onto the front surface of the sub-mount, and a block soldered onto the back surface of the sub-mount. The semiconductor element protrudes outward beyond a first side surface of the sub-mount, a concave portion is formed on each of a second side surface and a third side surface of the sub-mount perpendicular to the first side surface, the concave portion extending from the front surface of the sub-mount toward the back surface of the sub-mount, and the concave portion is disposed to allow a projection of a collet to be held in the concave portion with the front surface of the sub-mount held by suction by the collet.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONCHIYODA-KU TOKYO 100-8310

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujino, Junji Tokyo, JP 54 443
Hata, Tadayoshi Tokyo, JP 7 17
Sato, Jin Isahaya, JP 65 803
Yoneda, Yutaka Tokyo, JP 70 1337

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