Package structure and manufacturing method of the same

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United States of America Patent

PATENT NO 12062742
APP PUB NO 20230231087A1
SERIAL NO

17653659

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Abstract

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A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.

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Patent Owner(s)

Patent OwnerAddress
UNIMICRON TECHNOLOGY CORPNO 179 SHANYING RD GUISHAN DIST TAOYUAN CITY 333

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ying-Chu Chiayi, TW 8 18
Ko, Cheng-Ta Taipei, TW 78 166
Kuo, Chi-Hai Taoyuan, TW 18 4
Li, Jeng-Ting Pingtung County, TW 6 1
Lin, Pu-Ju Hsinchu, TW 51 13
Tseng, Hao-Wei Hsinchu County, TW 2 2

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