System and method for bending crystal wafers for use in high resolution analyzers

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United States of America Patent

PATENT NO 12062465
APP PUB NO 20240062928A1
SERIAL NO

17892020

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Abstract

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The invention provides a method for fabricating analyzers, the method comprising providing a radiation manipulating material on a first surface of a flexible support; contacting a second surface of the flexible support to a permeable mold, wherein the mold has a first flexible support contact surface and a second surface; and applying negative pressure to the second side of the flexible support to cause the flexible support to conform to the first flexible support contact surface of the mold. Also provided is a system for fabricating crystal analyzers, the system comprising crystal structures reversibly attached to a flexible support; a porous mold reversibly contacting the flexible support, wherein the mold defines a topography; and a negative pressure applied to the flexible support to cause the crystal structures to conform to the topography.

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Patent Owner(s)

Patent OwnerAddress
UCHICAGO ARGONNE LLC5801 SOUTH ELLIS AVENUE CHICAGO IL 60637

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aran, Emily K Westchester, US 1 0
Gog, Thomas Woodridge, US 1 0
Kim, Jung Ho Naperville, US 233 1570
Said, Ayman H Lombard, US 1 0

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