Semiconductor device and trimming method of the same
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United States of America Patent
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Aug 13, 2024
Grant Date -
May 25, 2023
app pub date -
Nov 19, 2021
filing date -
Nov 19, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a semiconductor substrate on which a temperature sensor is formed, a plurality of insulating films formed above the semiconductor substrate, a temperature measurement wiring pattern formed on a first insulating film which is one of the plurality of the insulating films, a detection electrode which is formed on the uppermost insulating film of the plurality of the insulating films to be arranged at a position corresponding to the first temperature measurement wiring pattern and is provided for contact a temperature measurement needle, and one or more via electrodes formed in one or more insulating film between the temperature measurement electrode and the detection electrode to couple between the temperature measurement electrode and the detection electrode.
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