Surface-treated copper foil and copper clad laminate

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United States of America Patent

PATENT NO 12060647
APP PUB NO 20230019067A1
SERIAL NO

17543645

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Abstract

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A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of (111) plane to the sum of the integrated intensities of diffraction peaks of (111) plane, (200) plane, and (220) plane of the treating surface is at least 60%.

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Patent Owner(s)

Patent OwnerAddress
CHANG CHUN PETROCHEMICAL CO LTDTAIPEI CITY 104

International Classification(s)

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  • 2021 Application Filing Year
  • C25D Class
  • 542 Applications Filed
  • 234 Patents Issued To-Date
  • 43.18 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, Jui-Chang Taipei, TW 42 76
Lai, Chien-Ming Taipei, TW 62 545
Lai, Yao-Sheng Taipei, TW 43 65

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Patent Citation Ranking

  • 0 Citation Count
  • C25D Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges6911701 - 10050100150200250300350400450500550600650700750

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