Hard mask, substrate processing method, and substrate processing apparatus

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United States of America Patent

PATENT NO 12060635
APP PUB NO 20200370172A1
SERIAL NO

16881787

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Abstract

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In a hard mask formed on a target film formed on a substrate, a first film having a stress in a first direction and a second film having a stress in a second direction opposite to the first direction are alternately stacked one or more times.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishizaka, Tadahiro Nirasaki, JP 118 6906
Morisada, Yoshinori Nirasaki, JP 29 3861
Moriya, Tsuyoshi Tokyo, JP 154 1601

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