Thermal metamaterial for low power MEMS thermal control

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United States of America Patent

PATENT NO 12055927
APP PUB NO 20220276615A1
SERIAL NO

17187296

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Abstract

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A thermal metamaterial device comprises at least one MEMS thermal switch, including a substrate layer including a first material having a first thermal conductivity, and a thermal bus over a first portion of the substrate layer. The thermal bus includes a second material having a second thermal conductivity higher than the first thermal conductivity. An insulator layer is over a second portion of the substrate layer and includes a third material that is different from the first and second materials. A thermal pad is supported by a first portion of the insulator layer, the thermal pad including the second material and having an overhang portion located over a portion of the thermal bus. When a voltage is applied to the thermal pad, an electrostatic interaction occurs to cause a deflection of the overhang portion toward the thermal bus, thereby providing thermal conductivity between the thermal pad and the thermal bus.

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Patent Owner(s)

Patent OwnerAddress
HONEYWELL INTERNATIONAL INC101 COLUMBIA ROAD P O BOX 2245 MORRISTOWN NJ 07962-2245

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Compton, Robert Loretto, US 38 276
Fertig, Chad Bloomington, US 52 154
Kriz, Jeffrey James Eden Prairie, US 9 26

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