Securing a probe to a device under test
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United States of America
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Aug 6, 2024
Grant Date -
N/A
app pub date -
Jun 4, 2021
filing date -
Jun 4, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A method of securing a probe tip to a device under test (DUT), the method comprising: positioning the probe tip near a test point of the DUT, the probe tip comprising a connection point on a signal-path portion of the probe tip and an attachment tab, the connection point making an electrical connection with the test point of the DUT, the attachment tab extending away from the signal-path portion of the probe tip; applying an adhesive to the DUT through a hole in the attachment tab of the probe tip; and curing the adhesive to secure the probe tip to the DUT.
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