Method for soldering electronic component and method for manufacturing LED display

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12051887
APP PUB NO 20230068569A1
SERIAL NO

17984263

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Abstract

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A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.

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Patent Owner(s)

Patent OwnerAddress
MICRAFT SYSTEM PLUS CO LTD6 F NO 609 SEC 1 WANSHOU RD GUISHAN DIST TAOYUAN CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liao, Chien-Shou Taichung, TW 90 92

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