Package structure and manufacturing method of package structure thereof
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United States of America Patent
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Jul 30, 2024
Grant Date -
Aug 18, 2022
app pub date -
May 9, 2022
filing date -
Jan 30, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A package structure including at least one semiconductor die and a redistribution structure is provided. The semiconductor die is laterally encapsulated by an encapsulant, and the redistribution structure is disposed on the semiconductor die and the encapsulant and electrically connected with the semiconductor die. The redistribution structure includes signal lines and a pair of repair lines. The signal lines include a pair of first signal lines located at a first level, and each first signal line of the pair of first signal lines has a break that split each first signal line into separate first and second fragments. The pair of repair lines is located above the pair of first signal lines and located right above the break. Opposite ending portions of each repair line are respectively connected with the first and second fragments with each repair line covering the break in each first signal line.
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