Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12051604
APP PUB NO 20220216077A1
SERIAL NO

17544197

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Abstract

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An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO KOREA SUWON SUWON GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishimoto, Tatsuya Kanagawa, JP 12 9
Izumita, Masanori Kanagawa, JP 5 26
Kajinami, Masato Kanagawa, JP 15 14
Moroishi, Fumitaka Kanagawa, JP 10 8
Nagatomo, Daisuke Kanagawa, JP 5 3
Sugiura, Takamasa Kanagawa, JP 11 103
Tokumiya, Takahiro Kanagawa, JP 14 53
Ueyama, Shinji Kanagawa, JP 15 19

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