Copper alloy plate and method for producing same

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United States of America

PATENT NO 12049690
SERIAL NO

17602391

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Abstract

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There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.

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Patent Owner(s)

Patent OwnerAddress
DOWA METALTECH CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyama, Tomotsugu Tokyo, JP 11 32
Narieda, Hiroto Tokyo, JP 29 84
Sugimoto, Takanobu Tokyo, JP 3 1
Yoshida, Kazuki Tokyo, JP 68 337

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