Method and device including laser heating of gripper for repairing a test contact arrangement
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United States of America Patent
Stats
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Jul 30, 2024
Grant Date -
Sep 30, 2021
app pub date -
Jun 19, 2019
filing date -
Aug 7, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.
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