Power module and power device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12048122
APP PUB NO 20230225087A1
SERIAL NO

17941194

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Importance

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Abstract

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A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.

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Patent Owner(s)

Patent OwnerAddress
NIKO SEMICONDUCTOR CO LTD12F NO 368 GONGJIAN RD XIZHI DIST NEW TAIPEI CITY 221

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Chih-Cheng Taoyuan, TW 40 118
Leng, Chung-Ming New Taipei, TW 13 146
Wang, Wei-Lun New Taipei, TW 7 3

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