Packaged ultraviolet light-emitting device and production method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12046704
APP PUB NO 20210184087A1
SERIAL NO

17188902

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Abstract

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A packaged ultraviolet light-emitting device includes a support member, at least one ultraviolet light-emitting chip, and an encapsulating cover. The support member has opposite top and bottom surfaces, a side surface interconnecting the top and bottom surfaces, and at least one indentation. The ultraviolet light-emitting chip is disposed on the top surface of the support member. The encapsulating cover is made from a fluorine-containing resin, and is disposed over and in contact with the ultraviolet light-emitting chip and the top surface and the indentation of the support member. The encapsulating cover extends into the indentation. A production method of the packaged ultraviolet light-emitting device is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO LTDYUANQIAN VILLAGE SHIJING TOWN NAN'AN CITY QUANZHOU CITY FUJIAN PROVINCE QUANZHOU CITY FUJIAN PROVINCE 362343

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Chih-wei Xiamen, CN 102 662
Hsu, Chen-ke Xiamen, CN 108 284
Liao, Yanqiu Xiamen, CN 10 7
Shi, Junpeng Xiamen, CN 43 69
Tu, Jianbin Xiamen, CN 2 2
Wong, Weng-Tack Xiamen, CN 21 21

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