Packaging of a semiconductor device with a plurality of leads
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United States of America Patent
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Jul 23, 2024
Grant Date -
Aug 10, 2023
app pub date -
Apr 17, 2023
filing date -
Jan 27, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a plurality of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin covering the semiconductor element and a part of each lead. The sealing resin includes a first edge, a second edge perpendicular to the first edge, and a center line parallel to the first edge. The reverse surfaces of the respective leads include parts exposed from the sealing resin, and the exposed parts include an outer reverse-surface mount portion and an inner reverse-surface mount portion that are disposed along the second edge of the sealing resin. The inner reverse-surface mount portion is closer to the center line of the sealing resin than is the outer reverse-surface mount portion. The outer reverse-surface mount portion is greater in area than the inner reverse-surface mount portion.
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