Semiconductor module comprising a resin case and an external connection terminal
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United States of America
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Jul 23, 2024
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N/A
app pub date -
Dec 6, 2021
filing date -
Dec 6, 2021
priority date (Note) -
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Abstract
A semiconductor module includes a resin case housing a semiconductor element; an insulating layer extending outward from the resin case; and a first external connection terminal extending outward from the resin case, arranged above the insulating layer so as to face the insulting layer, the first external connection terminal having a non-contact portion that is not in contact with the insulating layer in a thickness direction of the insulating layer at a position overlapping the insulating layer in a plan view.
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