Device of mass transferring chips
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United States of America Patent
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Jul 23, 2024
Grant Date -
Nov 10, 2022
app pub date -
Sep 22, 2021
filing date -
May 5, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.
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