Method and apparatus for optimization of lithographic process

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United States of America Patent

PATENT NO 12044981
APP PUB NO 20210349402A1
SERIAL NO

17381817

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Abstract

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A lithographic process is performed on a set of semiconductor substrates consisting of a plurality of substrates. As part of the process, the set of substrates is partitioned into a number of subsets. The partitioning may be based on a set of characteristics associated with a first layer on the substrates. A fingerprint of a performance parameter is then determined for at least one substrate of the set of substrates. Under some circumstances, the fingerprint is determined for one substrate of each subset of substrates. The fingerprint is associated with at least the first layer. A correction for the performance parameter associated with an application of a subsequent layer is then derived, the derivation being based on the determined fingerprint and the partitioning of the set of substrates.

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Patent Owner(s)

Patent OwnerAddress
ASML NETHERLANDS B VP O BOX 324 VELDHOVEN 5500 AH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Min-Sub Yongin-Si, KR 3 11
Hauptmann, Marc Turnhout, BE 22 93
Kou, Weitian Eindhoven, NL 14 39
Kupers, Michiel Veldhoven, NL 13 79
Mos, Everhardus Cornelis Best, NL 81 800
Ypma, Alexander Veldhoven, NL 42 558
Yu, Hyunwoo Hwaseong-si, KR 6 34

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