Method for forming components without adding tabs during etching

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United States of America Patent

PATENT NO 12044965
APP PUB NO 20210247691A1
SERIAL NO

17171886

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.

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Patent Owner(s)

Patent OwnerAddress
HUTCHINSON TECHNOLOGY INCORPORATED40 WEST HIGHLAND PARK DRIVE NE HUTCHINSON MN 55350

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Olsen, Clark T Dassel, US 14 16
Ribar, Jeffery G Brownton, US 3 2

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