Allowance setting system, substrate inspection device, allowance setting method, and substrate inspection method
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United States of America Patent
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Jul 16, 2024
Grant Date -
Oct 6, 2022
app pub date -
Jun 21, 2019
filing date -
Jun 21, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
An allowance setting system, a substrate inspection device, an allowance setting method, and a substrate inspection method that can set an appropriate inspection allowance are provided in which a normal mounting position of electronic component on a component mounting surface of substrate is defined as normal position. A deviation of an actual mounting position of electronic component in a surface direction of the component mounting surface with respect to the normal position is defined as surface direction deviation. A deviation of the actual mounting position of electronic component in a rotation direction within the component mounting surface with respect to normal position is defined as angular deviation. Allowance setting system sets multiple surface direction inspection allowances according to angular deviation for evaluating surface direction deviation in a substrate inspection before reflow.
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