Substrate debonding from bonded part

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United States of America

PATENT NO 12040311
SERIAL NO

18145462

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Abstract

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A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.

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Patent Owner(s)

Patent OwnerAddress
THE BOEING COMPANY929 LONG BRIDGE DRIVE ARLINGTON VA 22202

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abijaoude, Charbel Newbury Park, US 7 0
Brewer, Peter D Westlake Village, US 57 1026
Carrasco, Diego Eduardo Los Angeles, US 6 0
Chang, Chia-Ming Agoura Hills, US 220 956
Terterian, Sevag Lake Balboa, US 15 15

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