Processing tape and method of fabricating a semiconductor device using the same

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United States of America

PATENT NO 12040213
SERIAL NO

17191163

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Abstract

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A processing tape may include a base layer, an adhesive layer disposed on the base layer, a protection release film on the adhesive layer, and a first release layer interposed between the adhesive layer and the protection release film. The first release layer may include a silicone-based material and may be non-photo-curable.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jin, Hwail Seongnam-si, KR 16 55
Kim, Yeongseok Hwaseong-si, KR 19 41
Lee, Seon Ho Cheonan-si, KR 28 104

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