Copper alloys with high strength and high conductivity, and processes for making such copper alloys

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United States of America

PATENT NO 12037671
SERIAL NO

17603187

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Abstract

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A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.

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Patent Owner(s)

Patent OwnerAddress
MATERION CORPORATION6070 PARKLAND BOULEVARD MAYFIELD HEIGHTS OH 44124

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuli,, Jr John C Mayfield Heights, US 1 0
Taylor, Christopher J Mayfield Heights, US 27 623
Trybus, Carole L Mayfield Heights, US 5 4

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