Nano-twinned Cu—Ni alloy layer and method for manufacturing the same

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United States of America Patent

PATENT NO 12037670
APP PUB NO 20230220517A1
SERIAL NO

17708371

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Abstract

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A nano-twinned Cu—Ni alloy layer is provided, wherein more than 50% in volume of the nano-twinned Cu—Ni alloy layer comprises plural twinned grains, the plural twinned grains comprise plural columnar twinned grains, and a Ni content in the nano-twinned Cu—Ni alloy layer is in a range from 0.05 at % to 20 at %. In addition, a method for manufacturing the aforesaid nano-twinned Cu—Ni alloy layer is also provided.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL YANG MING CHIAO TUNG UNIVERSITYNO 1001 DAXUE RD EAST DIST HSINCHU CITY 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yu-I Zhubei, TW 1 0
Chen, Chih Hsinchu, TW 38 207
Chen, Yun-Hsuan Taichung, TW 7 10
Lee, Kang-Ping Hsinchu, TW 2 1

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