Substrate processing control system, substrate processing control method, and program

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United States of America Patent

PATENT NO 12036634
APP PUB NO 20190240799A1
SERIAL NO

16338931

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Abstract

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A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 144-8510

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishii, Yu Tokyo, JP 38 531
Oishi, Kunio Tokyo, JP 20 88
Takeda, Koichi Tokyo, JP 102 1910
Torikoshi, Tsuneo Tokyo, JP 21 60
Watanabe, Katsuhide Tokyo, JP 68 976
Yasuda, Hozumi Tokyo, JP 107 2107

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