Method and system for stacking printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12035474
APP PUB NO 20230097863A1
SERIAL NO

17544766

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Importance

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Abstract

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A method and a system for stacking printed circuit boards includes providing a lower baseboard, a pinboard, and an upper baseboard; printing a first solder paste on the lower baseboard; placing a placement component on the lower baseboard; placing the pinboard on the lower baseboard; reflow soldering the lower baseboard with the placement component and the pinboard and forming a first assembly; printing the first solder paste and a second solder paste on the upper baseboard; placing the placement component on the upper baseboard and the first assembly on the upper baseboard; and reflow soldering the upper baseboard with the placement component and the first assembly and forming a printed circuit board; a melting point of the first solder paste is higher than a melting point of the second solder paste.

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Patent Owner(s)

Patent OwnerAddress
CHIUN MAI COMMUNICATION SYSTEMS INCNO 4 MINSHENG ST TU-CHENG DIST NEW TAIPEI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Yen-Chung New Taipei, TW 3 1
Liao, Chi-Yi New Taipei, TW 8 43
Wang, Wen-Yu Shenzhen, CN 31 380

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