Enhanced electronic sensors
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United States of America
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Jul 9, 2024
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app pub date -
Sep 16, 2021
filing date -
Sep 16, 2021
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Abstract
A micro-structured device that can improve sensitivity and signal-to-noise for electronic sensor materials is embedded in electrically resistive materials. The technology includes a three-dimensional embedded electrode structure and fabrication methods for making the device for electronic sensing in bulk resistive materials. Embedded electrode structures address issues in conventional sensors by allowing independent control of sensitive material thickness, area, electric field intensity, and field direction.
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