Connection body, method for manufacturing connection body, and connection method
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United States of America Patent
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Jul 9, 2024
Grant Date -
Aug 12, 2021
app pub date -
Jun 6, 2019
filing date -
Jun 6, 2018
priority date (Note) -
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Abstract
A connection body, a method for manufacturing a connection body, and a connection method which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. In a connection body in which a first component having a first electrode and a second component having a second electrode are connected to each other via a filler-containing film having a filler-aligned layer in which independent fillers are aligned in a binder resin layer, the maximum effective connection portion area where the first electrode and the second electrode face each other is 4,000 μm2 or less and a ratio of the effective connection portion area to a particle area on the connection portion projection plane is 3 or more.
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