RF transmission line comprising at least one band-shaped line segment coupled to at least two coplanar waveguide segments in an extending direction
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 9, 2024
Grant Date -
Aug 24, 2023
app pub date -
Jun 29, 2022
filing date -
Feb 18, 2022
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
An electronic device includes a first body and a second body rotatably connected relative to each other through a pivot shaft having a metal portion, the first body including a first motherboard, the second body including a second motherboard; and a radio-frequency transmission line including at least one band-shaped line segment and at least two coplanar waveguide segments, the band-shaped line segment being coupled to the coplanar waveguide segments, in which one band-shaped line segment is located between two coplanar waveguide segments in an extending direction of the radio-frequency transmission line, the one band-shaped line segment is coupled to the pivot shaft to retain stationary relative to the pivot shaft, and the coplanar waveguide segments are spaced apart from the metal portion. The radio-frequency transmission line has a first end coupled to the first motherboard, and a second end coupled to the second motherboard.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
BEIJING XIAOMI MOBILE SOFTWARE CO LTD | BEIJING 100085 |
International Classification(s)

- 2022 Application Filing Year
- H01P Class
- 478 Applications Filed
- 199 Patents Issued To-Date
- 41.64 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Liang, Peiyu | Beijing, CN | 3 | 0 |
# of filed Patents : 3 Total Citations : 0 | |||
Liu, Tianbo | Beijing, CN | 13 | 110 |
# of filed Patents : 13 Total Citations : 110 | |||
Mu, Mengtian | Beijing, CN | 1 | 0 |
# of filed Patents : 1 Total Citations : 0 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- H01P Class
- 0 % this patent is cited more than
- 1 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jan 9, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 9, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 9, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Jul 09, 2024 | P | Publication | |
Jun 19, 2024 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jun 03, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
May 06, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
May 01, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: AWAITING TC RESP., ISSUE FEE NOT PAID |
Mar 12, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
Oct 24, 2023 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: FINAL REJECTION MAILED |
Aug 15, 2023 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
May 15, 2023 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NON FINAL ACTION MAILED |
Apr 28, 2022 | P | Published | |
Feb 11, 2022 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
Jan 06, 2022 | F | Filing | |
Jan 06, 2022 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NAGASHIMA, TATSUO;KITAOKA, KENJI;SIGNING DATES FROM 20211213 TO 20211215;REEL/FRAME:058573/0782 Owner name: AGC INC., JAPAN |
Jan 06, 2022 | FEPP | FEE PAYMENT PROCEDURE | free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Jul 24, 2019 | PD | Priority Date |

Matter Detail

Renewals Detail
