Multilayer electronic component
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United States of America Patent
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Jul 9, 2024
Grant Date -
Nov 30, 2023
app pub date -
Oct 19, 2022
filing date -
May 25, 2022
priority date (Note) -
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Abstract
A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, external electrodes disposed on the body to be connected to the internal electrodes, and a metal oxide disposed between the body and the external electrodes. The metal oxide includes calcium (Ca), zinc (Zn), and silicon (Si), and further includes at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).
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