Method and device for cleaning substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12032302
APP PUB NO 20220308464A1
SERIAL NO

17367835

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Abstract

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In a method of manufacturing a semiconductor device a semiconductor wafer is retrieved from a load port. The semiconductor wafer is transferred to a treatment device. In the treatment device, the surface of the semiconductor wafer is exposed to a directional stream of plasma wind to clean a particle from the surface of the semiconductor wafer. The stream of plasma wind is generated by an ambient plasma generator and is directed at an oblique angle with respect to a perpendicular plane to the surface of the semiconductor wafer for a predetermined plasma exposure time. After the cleaning, a photo resist layer is disposed on the semiconductor wafer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chia-Jen Jhudong Township, TW 98 1413
Lee, Hsin-Chang Zhubei, TW 203 1090
Lin, Chen-Yang Zhudong Township, TW 17 187
Lin, Kuan-Wen Taichung, TW 23 45
Liu, Chung-Hsuan Taichung, TW 5 7
Sung, Ku-Hsiang Taoyuan, TW 3 1
Yu, Da-Wei Hsinchu, TW 5 4

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