Integrated circuit packages having electrical and optical connectivity and methods of making the same
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United States of America Patent
Stats
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Jul 9, 2024
Grant Date -
Feb 11, 2021
app pub date -
Apr 3, 2019
filing date -
Apr 3, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).
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International Classification(s)
- 2019 Application Filing Year
- C03C Class
- 943 Applications Filed
- 575 Patents Issued To-Date
- 60.98 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C03C Class
- 0 % this patent is cited more than
- 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jan 9, 2028 |
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| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 9, 2036 |
