Shielded printed wiring board, method for manufacturing shielded printed wiring board, and connecting member
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 2, 2024
Grant Date -
Feb 10, 2022
app pub date -
Mar 17, 2020
filing date -
Mar 17, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member. The shielded printed wiring board of the present invention includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; a connecting member including a metal foil and a conductive filler fixed to the metal foil with an adhesive resin; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the electromagnetic wave shielding film is arranged on the substrate film in such a manner that the insulating layer of the electromagnetic wave shielding film is located on the shielding layer of the electromagnetic wave shielding film, the connecting member is arranged on the electromagnetic wave shielding film in such a manner that the conductive filler of the connecting member penetrates the insulating layer of the electromagnetic wave shielding film and that the conductive filler of the connecting member is in contact with the shielding layer of the electromagnetic wave shielding film, the reinforcing member is arranged on the electromagnetic wave shielding film and the connecting member in such a manner that the conductive adhesive layer of the reinforcing member is in contact with the insulating layer of the electromagnetic wave shielding film and the metal foil of the connecting member, and the ground circuit of the substrate film is electrically connected to the metal reinforcing plate of the reinforcing member.
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