Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method

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United States of America Patent

PATENT NO 12028099
APP PUB NO 20230179240A1
SERIAL NO

18104761

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Abstract

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A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCNO 1 DUSING RD 1ST SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yen-Tso Hsinchu, TW 12 107
Cheng, Jen-Hao Hsinchu, TW 11 27
Chu, Hsiang-Yun Hsinchu, TW 3 1
Hsu, Jui-Lin Hsinchu, TW 19 62
Hsu, Wei-Hsiu Hsinchu, TW 11 42
Hung, Chih-Ming San Jose, US 86 677
Lin, Tzu-Chin Hsinchu, TW 23 350
Zhan, Jing-Hong Conan Hsinchu, TW 35 369

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