Receivers for high density and low latency chip-to-chip links

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United States of America Patent

PATENT NO 12028057
APP PUB NO 20240106431A1
SERIAL NO

17951790

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Abstract

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A system includes a receiver. The receiver includes an input stage having an input and an output, and a first resistor coupled between the output of the input stage and the input of the input stage. The receiver also includes an output stage having an input and an output, wherein the input of the output stage is coupled to the output of the input stage, and a feedback path coupled between the output of the output stage and the input of the input stage, the feedback path including a second resistor.

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Patent Owner(s)

Patent OwnerAddress
QUALCOMM INCORPORATED5775 MOREHOUSE DRIVE SAN DIEGO CA 92121-1714

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Roham, Masoud San Diego, US 22 486

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