Semiconductor module including semiconductor package and semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12025656
APP PUB NO 20210080501A1
SERIAL NO

17107244

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Abstract

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A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Dan-Kyu Anyang-si, KR 5 6
Lee, Sang-Yeol Suwon-si, KR 10 29
Won, Seyoung Seoul, KR 2 1

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