Laser machining method and laser machining device

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United States of America Patent

PATENT NO 12023760
APP PUB NO 20220234144A1
SERIAL NO

17615714

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Abstract

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A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTD2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 1008332 ?1008332

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goya, Saneyuki Tokyo, JP 48 207
Inoue, Akiko Tokyo, JP 75 618
Mori, Hiroki Tokyo, JP 338 3426

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