Substrate processing method

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United States of America

PATENT NO 12020934
SERIAL NO

17233384

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Abstract

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A substrate processing method of preventing damage to a lower patterned structure includes: forming a first thin film having a certain thickness by performing a first cycle a plurality of times, the first cycle including supplying a first reactant on a structure and purging a residue, and forming a second thin film by changing a chemical composition of the first thin film having the certain thickness.

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ASM IP HOLDING B VALMERE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, SeungWoo Hwaseong-si, KR 18 860
Gu, YeaHyun Hwaseong-si, KR 7 233
Kim, Hyunchul Hwaseong-si, KR 358 5057
Lee, SeungHyun Seoul, KR 196 487

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