Grounding cap module and gas injection device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12020906
APP PUB NO 20230110291A1
SERIAL NO

18079903

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A grounding cap module includes a main body, a frame portion, and a cap portion. The main body includes a first opening penetrating the main body and a grounding portion disposed on a periphery of the main body and configured to be electrically grounded. The frame portion is disposed on the main body and includes a second opening aligned with the first opening. The cap portion is disposed on the frame portion and covers the second opening, wherein the first opening, the second opening and the cap portion define a receiving cavity. A gas injection device and an etching apparatus using the same are also provided.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSIN-CHU 300-77

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Shih-Tsung New Taipei, TW 20 44
Liu, Li-Shi Taipei, TW 6 1

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges397216101 - 10025050075010001250150017502000225025002750300032503500375040004250

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