Bonding layer evaluation system and bonding layer evaluation method
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United States of America
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Jun 25, 2024
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N/A
app pub date -
Dec 20, 2019
filing date -
Dec 20, 2019
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In Force
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Abstract
A bonding layer evaluation system includes an elastic wave generation device configured to generate an elastic wave from a sample including a bonding layer; an elastic wave reflection body configured to reflect the elastic wave generated from the sample; a sample installation unit provided between the elastic wave generation device and the elastic wave reflection body; an elastic wave detection device disposed in a direction in which the elastic wave is reflected by the elastic wave reflection body, and configured to detect the reflected elastic wave; and a control device configured to evaluate a parameter related to the bonding layer. The control device evaluates the parameter related to the bonding layer by comparing the actual value of the elastic wave detected by the elastic wave detection device with a theoretical value of the elastic wave calculated based on a theoretical model related to the sample.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MITSUBISHI HEAVY INDUSTRIES LTD | TOKYO 100 | |
THE RITSUMEIKAN TRUST | 8 NISHINOKYO-HIGASHI-TOGANOO-CHO NAKAGYO-KU KYOTO-SHI KYOTO 6048520 | |
KYOTO UNIVERSITY | KYOTO CITY KYOTO-FU |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kamo, Sota | Tokyo, JP | 21 | 5 |
Matsuda, Naoki | Kyoto, JP | 229 | 1557 |
Mori, Naoki | Shiga, JP | 130 | 1430 |
Takagi, Kiyoka | Tokyo, JP | 40 | 27 |
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