Bonding layer evaluation system and bonding layer evaluation method

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United States of America

PATENT NO 12019049
SERIAL NO

17415897

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Abstract

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A bonding layer evaluation system includes an elastic wave generation device configured to generate an elastic wave from a sample including a bonding layer; an elastic wave reflection body configured to reflect the elastic wave generated from the sample; a sample installation unit provided between the elastic wave generation device and the elastic wave reflection body; an elastic wave detection device disposed in a direction in which the elastic wave is reflected by the elastic wave reflection body, and configured to detect the reflected elastic wave; and a control device configured to evaluate a parameter related to the bonding layer. The control device evaluates the parameter related to the bonding layer by comparing the actual value of the elastic wave detected by the elastic wave detection device with a theoretical value of the elastic wave calculated based on a theoretical model related to the sample.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTDTOKYO 100
THE RITSUMEIKAN TRUST8 NISHINOKYO-HIGASHI-TOGANOO-CHO NAKAGYO-KU KYOTO-SHI KYOTO 6048520
KYOTO UNIVERSITYKYOTO CITY KYOTO-FU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamo, Sota Tokyo, JP 21 5
Matsuda, Naoki Kyoto, JP 229 1557
Mori, Naoki Shiga, JP 130 1430
Takagi, Kiyoka Tokyo, JP 40 27

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